Siemens Acquires UltraSoC to Drive Design for Silicon Lifecycle Management

Author photo: David Humphrey
ByDavid Humphrey
Category:
Acquisition or Partnership

Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).  Siemens plans to integrate UltraSoC’s technology into the Xcelerator portfolio as part of Mentor’s Tessent software product suite.  

The addition of UltraSoC to Siemens enables a unified data-driven infrastructure that can enhance product quality, safety and cybersecurity, and the creation of a comprehensive solution to help semiconductor industry customers overcome key pain points, including manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks.

UltraSoC is a pioneer of embedding monitoring hardware into complex SoCs to enable “fab-to-field” analytics capabilities designed to accelerate silicon bring-up, optimize product performance, and confirm that devices are operating “as designed” for functional safety and cybersecurity purposes.  Tessent is a market leader in SoC design-for-test (DFT) solutions and has established strengths in the field of automotive functional safety via its Tessent Safety Ecosystem.  These two highly complementary offerings are the foundation of a complete package of solutions, encompassing semiconductor design and production, functional safety, cybersecurity, and functional optimization of products in the field.

The combination of Siemens and UltraSoC technology can benefit the entire semiconductor product lifecycle, including structural, electrical, and functional capabilities of SoCs.  It also supports Siemens’ comprehensive digital twin with UltraSoC providing monitoring of the real device.

UltraSoC‘s products are widely used in the automotive, high-performance computing, storage and semiconductor industries.  The company was recently selected as a participant in the DARPA AISS (Automatic Implementation of Secure Silicon) program and is a member of the Secure-CAV consortium, a collaborative project that aims to improve the safety and security of tomorrow’s connected and autonomous vehicles (CAVs).

Siemens’ acquisition of UltraSoC is due to close in the fourth quarter of Siemens’ fiscal year 2020.  Terms of the transaction were not disclosed.

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